Wafer bumping can provide significant performancebảng tỷ số bóng đá, outline dimensions, and overall cost advantages in semiconductor packaging. Extensive experience in numerous alloy mate…

Chip Probing is to needle test each grain on the waferbảng tỷ số bóng đá, and the probe is equipped with gold wire made of gold wire on the detection head, and the contact (pad) on the gra…

The main purpose of Chip On Glass packaging production line is to divide the wafer into the state of the grainbảng tỷ số bóng đá, and the process technology used includes grinding, cutting…

COF is a technology that combines Flip Chip Bonding on a Flexible Printed Circuit board (FPC) substrate. That isbảng tỷ số bóng đá, the driver IC and its electronic parts can be directly p…

Huaxin Zhenbang Testing Center provides environmental reliability experiments such as thermal shock testingbảng tỷ số bóng đá, pressure cooker testing (PCT), low-temperature testing, high-…